Evaluation of solid solution strengthening of copper-silicon binary alloys by carbide forming elements

Agatha Ifeoma Ijomah, Kingsley Chidi Nnakwo, Nkem Emelike Nwankwo, Ifeanacho Uchenna Okeke

Abstract: This study investigated the effects of carbide forming elements (manganese and tungsten) and solid solution heat treatment on the microstructure, tensile strength, hardness, and percentage elongation of copper-silicon binary alloys. The response of Cu-3Si-W and Cu-3Si-3Mn alloys on solid solution heat treatment was explored. The alloys compositions were designed and fabricated using stir-casting method. The cast samples were solution heat treated at 900oC for 5 h and prepared for tensile strength and hardness tests. The microstructure of the as-cast and solution heat treated samples was analyzed and linked with the change in the mechanical properties, using an optical microscope (OM). The microstructure analysis revealed even distributions of fine grains in the copper matrix. The solution heat treated samples showed finer grains which led to improvements of both ultimate tensile strength and hardness of Cu-3Si-W and Cu-3Si-3Mn alloys. The Cu-3Si-W alloys recorded maximum ultimate tensile strength and hardness of 298 MPaand 364 BHN, respectively after solid solution treatment. The solution heat treated Cu-3Si-3Mn alloys recorded maximum ultimate tensile strength of 385 MPa and 390 BHN. The percentage elongation of each alloys decreased after undergoing solid solution treatment. 

Keywords: Tungsten; manganese; carbide formers; microstructure; solid solution strengthening.

Title: Evaluation of solid solution strengthening of copper-silicon binary alloys by carbide forming elements

Author: Agatha Ifeoma Ijomah, Kingsley Chidi Nnakwo, Nkem Emelike Nwankwo, Ifeanacho Uchenna Okeke

International Journal of Mechanical and Industrial Technology      

ISSN 2348-7593 (Online)

Vol. 11, Issue 1, April 2023 - September 2023

Page No: 48-53

Research Publish Journals

Website: www.researchpublish.com

Published Date: 15-September-2023

DOI: https://doi.org/10.5281/zenodo.8348120

Vol. 11, Issue 1, April 2023 - September 2023

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Evaluation of solid solution strengthening of copper-silicon binary alloys by carbide forming elements by Agatha Ifeoma Ijomah, Kingsley Chidi Nnakwo, Nkem Emelike Nwankwo, Ifeanacho Uchenna Okeke