Solid solution-induced ultrafine Cu-3Si-Al and Cu-3Si-Mo ternary alloy

Agatha I. Ijomah, Kingsley C. Nnakwo, Nkem E. Nwankwo, Bonaventure C. Ugwuanyi

Abstract: Adequate control of composition, cooling rates, and heat treatment parameters is crucial to achieving the desired ultrafine microstructure and properties in copper-based alloys. In this experimental study, an ultrafine Cu-3Si-Al and Cu-3Si-Mo ternary alloy with improved tensile strength and hardness is developed. The alloys system were developed via stir-casting technique and subjected to solid solution heat treatment at 900oC for 5 h. The microstructures of the ternary alloys were analyzed and correlated with the investigated mechanical properties. Results showed that Cu-3Si-3Al alloy recorded ultimate tensile strength and hardness of 314 MPa and 278 BHN in as-cast condition. Incorporation of molybdenum to the parent alloy significantly increased the ultimate tensile strength, percentage elongation, and hardness. As-cast Cu-3Si-3Mo alloy recorded ultimate tensile strength and hardness of 130 MPa and 192 BHN, respectively. After solution heat treatment, ultimate tensile strength and hardness of Cu-3Si-3Al alloy increased from 314 MPa to 322 MPa, and from 192 BHN to 201 BHN. On the same condition, Cu-3Si-3Mo alloy recorded about 29.2% and 4.7% increase in ultimate tensile strength and hardness compared to the as-cast Cu-3Si-3Mo alloy. This mechanical behavior can be attributed to increased solid solution region and fine grains accompanying increasing addition of aluminium and molybdenum.

Keywords: Solid solution; microstructure; properties; tensile strength; hardness.

Title: Solid solution-induced ultrafine Cu-3Si-Al and Cu-3Si-Mo ternary alloy

Author: Agatha I. Ijomah, Kingsley C. Nnakwo, Nkem E. Nwankwo, Bonaventure C. Ugwuanyi

International Journal of Engineering Research and Reviews

ISSN 2348-697X (Online)

Vol. 11, Issue 3, July 2023 - September 2023

Page No: 59-63

Research Publish Journals

Website: www.researchpublish.com

Published Date: 15-September-2023

DOI: https://doi.org/10.5281/zenodo.8348425

Vol. 11, Issue 3, July 2023 - September 2023

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Solid solution-induced ultrafine Cu-3Si-Al and Cu-3Si-Mo ternary alloy by Agatha I. Ijomah, Kingsley C. Nnakwo, Nkem E. Nwankwo, Bonaventure C. Ugwuanyi